In subtractive manufacturing, material is removed from a workpiece. One particularly advanced material processing technique is ultra-short pulse laser ablation, which uses extremely short laser pulses for ablation. This process is highly accurate and minimizes heat-affected zones, making it particularly well-suited for applications that require precision at the microscale. One of the main advantages of ultrashort pulse laser ablation is that it can be applied to virtually any material, including metals, semiconductors, transparent materials and even sensitive biological samples.
You want to ablate material precisely, e.g. cutting, drilling or structuring?
Do you have accuracy requirements between 0.5 µm and 500 µm?
You want to work as damage-free as possible and avoid thermal effects?
Our team has many years of experience in the field of subtractive processing with fs lasers. We support you in the processing of a wide variety of materials and structures, carry out feasibility studies and create customer-specific systems.
In micromachining, ultrashort pulse laser ablation is used to create complex surface structures, drill microholes and fabricate microstructures. In the semiconductor industry, the technology is used to create precise features on integrated circuits. The technology can also be used to alter the wettability and adhesion of surfaces. Its versatility and precision make it an indispensable tool in a wide range of industries, from electronics to biomedical engineering.